Manuscript Number : CSEIT2173156
Forensic Analysis of Broken and Damaged Mobile Phone - A Crime Case Study
Authors(4) :-Akhlesh Kumar, Bhushan Ghode, Khevna Maniar, Dr. S. K. Jain Forensic laboratories are frequently subjected to mobile devices that are assailed by shock or forced damage which might be the result of intentional efforts to destroy proof from the devices or accidental exposure. Chip-off technique is an effective method for data retrieval from such kind of exhibits. However, nowadays all mobiles phones are securely encrypted with full disk encryption (FDE) or file-based encryption (FBE) which makes chip-off forensics an improbable process to successfully retrieve data. In many of these cases, the encryption is on the hardware and hence, the device could be successfully decrypted by bringing it in its original condition. Thus, the original user data can be obtained for investigative purposes. This process can be enabled by replacement of electronic parts of the original device which contains user data and decryption keys i.e. PCB to the new host. This research paper covers a case study of a mobile phone obtained in broken and shattered condition whose diagnosis of PCB and subsequent actions led to data recovery.
Akhlesh Kumar Full Disk Encryption, File Based Encryption, Decryption, PCB, broken & damaged mobile phone, UFED Touch 2 and Physical Analyzer, forensic repair toolkit. Publication Details Published in : Volume 7 | Issue 3 | May-June 2021 Article Preview
Assistant Director & Scientist - āCā, Central Forensic Science Laboratory, DFSS, MHA, Govt. of India, Chandigarh, India
Bhushan Ghode
Forensic Professional, Central Forensic Science Laboratory, DFSS, MHA, Govt. of India, Chandigarh, India
Khevna Maniar
Forensic Professional, Central Forensic Science Laboratory, DFSS, MHA, Govt. of India, Chandigarh, India
Dr. S. K. Jain
Director-cum-Chief Forensic Scientist, Central Forensic Science Laboratory, DFSS, MHA, Govt. of India, Chandigarh, India
Date of Publication : 2021-06-30
License: This work is licensed under a Creative Commons Attribution 4.0 International License.
Page(s) : 481-487
Manuscript Number : CSEIT2173156
Publisher : Technoscience Academy
Journal URL : https://res.ijsrcseit.com/CSEIT2173156
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